Silicon Innovation

Company Profile

Silicon Innovation was founded in 2019 and is headquartered in Chengdu. It specializes in high-performance interconnect solutions.Chip R&DAs a high-tech enterprise focused on sales, the company aims to break through core technological barriers in integrated circuits. It has established a full-stack product line covering clock chips, general-purpose interface chips such as PCIe/I3C, memory interface chips, network interface chips, and power management chips. Leveraging core technologies like low-latency architecture, signal enhancement, and protocol bridging, its products enable high-speed, reliable, and low-power signal transmission and system interconnectivity in data centers, smart vehicles, and industrial internet applications. Achieving internationally advanced performance levels, they have successfully replaced products from overseas manufacturers such as Skyworks and TI.

The company's R&D team accounts for over 70% of its workforce, holding more than 230 invention patents. It has been certified as a National Specialized, Sophisticated, Distinctive, and Innovative “Little Giant” enterprise, receiving significant capital and policy support. Currently, Silicon Innovation has entered the supply chains of leading industry clients and is deepening market penetration through customized services. With accelerating domestic substitution and the iteration of new technologies like PCIe 6.0 and optical interconnects, the company is poised to leverage its technological accumulation and ecosystem synergy to further expand its domestic and international markets, becoming a key player in the global interconnect chip sector.

In 2025, the company completed its shareholding system reform, changed its name to “Chengdu Silicon Innovation Technology Co., Ltd.,” and initiated the A-share IPO process, with China International Capital Corporation (CICC) serving as its listing advisor.

Products & Services

Silicon Innovation has built a full-stack interconnected chip solution covering five major product lines:

1. Clock and Universal Interface ChipIncludes clock generators (TGEN series), clock buffers (TBUF series), and I2C/I3C interface chips (INTL series), providing high-precision clock signal output, multi-frequency support, signal amplification, and synchronization capabilities.
2. PCIe Interface ChipCovering PCIe Retimers (XRET series), PCIe Bridges (XSAT series), and PCIe Switches (XPSW series), supporting high-speed signal retiming, protocol conversion, and multi-device connectivity.
3. Storage Interface ChipPCIe-to-SATA bridge chips (XSAT series) enable seamless integration between PCIe and SATA protocols, expanding storage interfaces.
4. Network Interface ChipIncluding optical interconnect chips and optical clock data recovery chips, supporting high-speed optical communication requirements.
5. Power Management IC：Provides step-down converters (DC-DC converters), multi-channel power management, and other solutions to optimize system energy efficiency.

Service modelCustomer-driven solutions encompass both standard cards (e.g., PCIe 5.0 Retimer optical interface cards) and custom cards (board customization services), enabling the implementation of system-level interconnect solutions.

core technology

1. Low-Latency Chip ArchitectureThe proprietary architecture delivers over 20% in transmission performance enhancement, meeting high-speed data transmission demands.
2. Signal Enhancement and Protocol Bridging TechnologyThrough clock synchronization, signal redriving, and protocol conversion, it ensures signal stability over long-distance, high-speed links.
3. Accumulation of proprietary intellectual propertyParticipated in the development of six major interface standards, holds over 230 invention patents, and possesses substantial technological barriers.
4. Full-Stack Product StrategyCovering key aspects such as signal enhancement, protocol bridging, clock synchronization, and universal/network interfaces to form a closed-loop technology system.

Technical Advantages::

• The clock buffer chip (such as the TBUF1510) outperforms competing products both domestically and internationally.
• The 10-channel output clock buffer chip supports the 32Gbps PCIe 5.0 specification, making it the industry's first of its kind.
• PCIe-to-SATA/USB bridge chips gain recognition from leading industry manufacturers.

Market Competitiveness

1. R&D Team Capabilities::
   • Over 70% of our team consists of R&D personnel, with core members averaging over 20 years of industry experience. Those holding 70% certifications possess more than a decade of accumulated expertise in the field.
   • The team excels in high-speed interfaces, complex system architectures, and other fields, demonstrating strong technological foresight.
2. market acceptance::
   • The product has entered critical applications such as data centers and new energy vehicles, replacing products from international manufacturers including Skyworks, TI, and Renesas.
   • Partners include industry headliners such as server vendors, smartmechanical personBusinesses, etc.
3. Capital and Policy Support::
   • The company has completed 10 rounds of financing, with investors including prominent institutions such as Xingwang Investment, Skyline Capital, and YaoTu Capital.
   • Awarded qualifications and honors including National Specialized, Sophisticated, Distinctive, and Innovative “Little Giant” Enterprise and Sichuan Provincial Specialized, Sophisticated, Distinctive, and Innovative SME.
4. Differentiated competition::
   • Focusing on niche markets, we deliver high-value solutions that break the monopoly of overseas manufacturers.
   • Meet diverse needs through customized services to enhance customer loyalty.

development prospect

1. Industry Trend Drivers::
   • The explosion of data and growing demand for real-time processing are driving the evolution of interconnect chips toward low latency, high reliability, and high performance.
   • Domestic substitution policies provide support, offering local enterprises opportunities for market expansion.
2. Technology Iteration Space::
   • Continue to develop next-generation interface technologies such as PCIe 6.0 and CXL to consolidate our technological leadership.
   • Expand into emerging fields such as optical interconnect and AI acceleration to break through growth ceilings.
3. Market Expansion Potential::
   • Domestic Market: Deepen cooperation with industries such as data centers and new energy vehicles to increase market share.
   • International Market: Strengthen capital strength through IPO financing, gradually expand overseas operations, and participate in global competition.
4. Ecological Synergy::
   • Establish partnerships with upstream and downstream enterprises (such as CPU manufacturers and equipment manufacturers) to build an industrial ecosystem.
   • Promote standard development to enhance industry influence.

Risks and challenges::

• The semiconductor industry is highly competitive, requiring continuous investment in research and development to maintain technological leadership.
• International trade frictions may impact supply chain stability, necessitating strengthened localization efforts.