JCET

Changdian Technology, full name of Jiangsu Changdian Technology Co., Ltd (stock code: 600584), is a global leadingICThe company is a manufacturer and technology service provider. The company is committed to providing global customers and partners with a full range of one-stop services for microsystem integration, including system integration package design of integrated circuits, technology development, product certification, wafer-in-test, wafer-level mid-channel package test, system-level package test, chip finished product test, and direct shipment to semiconductor suppliers around the world.

Everlight has a number of core technologies, such as highly integrated wafer-level WLP, 2.5D / 3D, System-in-Package (SiP) packaging technologies and high-performance Flip Chip and Leaded Interconnect packaging technologies. These technologies enable Everlight's products and technologies to cover mainstream IC system applications, including network communications, mobile terminals, high-performance computing, in-vehicle electronics, big data storage, artificial intelligence and Internet of Things (IoT), and industrial smart manufacturing.

The company has two R&D centers in China and South Korea, and six production bases for finished ICs in China, South Korea and Singapore, with marketing offices located around the world. This enables Changdian Technology to work closely with global customers on technology and provide efficient industrial chain support.

The history of Changdian Technology can be traced back to 1972, when Jiangyin Transistor Factory was established, marking the birth of the predecessor of Changdian Technology. After decades of development, CCTC has completed its transformation from a small factory in Jiangyin to a global giant in the chip packaging industry. In the course of development, Changdian Technology has experienced a number of important milestones, such as the company's formal reorganization into Jiangsu Changdian Technology Co., Ltd. in 2000, its successful listing on the Shanghai Stock Exchange in 2003, and a series of cross-border mergers and acquisitions and strategic cooperation in recent years.

core technology

Changdian's core technologies are mainly concentrated in the field of semiconductor packaging and testing, which include the following aspects:

1. Advanced Packaging Technology: CCTC has significant advantages in advanced packaging technologies, such as System-in-Package (SiP), Chip-Scale Packaging (CSP), and 3D integration technologies. These technologies can achieve higher integration and better performance to meet the requirements of miniaturization, high performance and high reliability of high-end electronic products.
2. SiP/AiP Technology: SiP (System in Package), or System-in-Package, is a technology that collects more ICs (integrated circuits) on the same surface to create highly integrated products. It has the advantages of small area and low cost, and is suitable for electronic products with short production cycle, such as Wifi module, RF module, watch, etc. AiP (Antenna in Package), on the other hand, is a further development of SiP, which integrates RF modules and antenna packages together, and is used in areas such as 5G millimeter wave antennas.
3. Fan-out Technology: ETech also has a presence in Fan-out technology, a special packaging technology that provides more pins and a larger area without increasing the package size to meet the demand for high performance and complex functions.

Everlight's business in the wearable field mainly involves packaging and testing services for smart wearable devices. As a leading global provider of integrated circuit manufacturing and technical services, ECT provides high-quality packaging and testing solutions for wearable devices based on its profound accumulation and technical strength in the field of system-in-package (SiP).

SiP packaging technology plays a crucial role in wearable devices. Since wearable devices usually require compactness, light weight, versatility and low power consumption, highly integrated SiP packaging technology can perfectly fulfill these needs. Through its advanced SiP packaging technology, Changdian Technology integrates multiple chips, sensors, and other components into a compact package, thus realizing miniaturization, high integration, and low power consumption of wearable devices.

In addition, Everlight provides customized packaging and testing services for wearable devices. According to the specific needs of customers, ETech can design and manufacture packaging products that meet the requirements, and ensure that their quality and performance meet the customer's requirements through rigorous testing. These services cover the entire process from design, manufacturing to testing, providing all-round support for the development and production of wearable devices.

Against the backdrop of the rapid development of the wearable device market, Eternal Power Technology has become a partner of many wearable device manufacturers by virtue of its expertise and technical strength in the field of packaging and testing. By working closely with these partners, Everlight not only provides high-quality packaging and testing services for wearable devices, but also promotes the development and innovation of the entire industry.