Oriental Calculation Chip Makes Its Official Debut: A Rising Star in 3D AI Chips Valued at 12.2 Billion, Aiming for Autonomous and Controllable Domestic Computing Power

On July 1, the official website and WeChat official account of Shanghai Dongfang Suanxin Technology Co., Ltd. (hereinafter referred to as ”Dongfang Suanxin”) were simultaneously launched. This company, founded by Chinachip designThe 3D AI chip company led by Wei Shaojun, a leading authority in the field, has finally been unveiled. According to authoritative sources, Dongfang Suanxin achieved a post-investment valuation of as high as‌ in its Series A+ funding round, which was completed in late April 2026.12.275 billion yuan‌, with the National Artificial Intelligence Industry Investment Fund prominently featured among them. The company announced that it will launch its Series B funding round in the fourth quarter of this year, adding another strong contender to the domestic high-end computing chip sector.

Three rounds of funding in two years—an astonishing pace

The story of Dongfang Suanxin began on May 20, 2024. On that day, the company was officially incorporated at 2305 Zuchong Road in the China (Shanghai) Pilot Free Trade Zone, with a registered capital of 10.5 million RMB and Peng Guiqiang as its legal representative.

However, although this company may seem ”young,” its technological foundations are deeply rooted in‌2006‌. The company’s technological roots trace back to the Mobile Computing Research Center at Tsinghua University’s School of Integrated Circuit Science and Engineering, where it has built up more than a decade of in-depth expertise in the field of reconfigurable computing—which means that by the time the company was officially established in 2024, its core technology had already been refined and honed over nearly two decades.

Less than two years after its founding, Dongfang Suanxin completed three rounds of financing at a pace that caught the industry’s attention:

In addition,‌Meituan, Xiaomi, JD.com, Didi‌Funds affiliated with internet giants also participated in the investment, with top-tier institutions such as Tsinghua-affiliated capital, Shanghai state-owned capital, and Hillhouse-Yurun all joining the round. The lineup of investors is so impressive that it can be described as an ”all-star lineup” in the domestic chip sector.

In terms of its national expansion, Dongfang Suanxin has also moved forward with determination: it established a Beijing branch in June 2024, expanded to Xi’an in August, set up operations in Nanjing in September, opened a Suzhou branch in December 2025, and will extend its reach to Chengdu in March 2026—with these five R&D centers covering the entire country, the company has built a comprehensive R&D network.

Led by Wei Shaojun, with Deep Roots in the Tsinghua Network

The most striking thing about Dongfang Suanxin is undoubtedly its leader—‌Wei Shaojun‌.

Wei Shaojun currently serves as the company’s Chairman and CEO. He is a tenured professor at Tsinghua University, a member of the International Eurasian Academy of Sciences, and a member of the National Advisory Committee on the Development of the Integrated Circuit Industry. He previously served as the convener of the Microelectronics and Optoelectronics Theme under the ”863 Program,” as well as the full-time technical lead, chief technical architect, and head of the general expert group for the National Major Science and Technology Special Project on Core Electronic Components, High-End General-Purpose Chips, and Basic Software. He also served as director of the Integrated Circuit Design Center at the China Academy of Post and Telecommunications Sciences and president of Datang Telecom. As Vice Chairman of the China Semiconductor Industry Association and Chairman of its Integrated Circuit Design Branch, Wei Shaojun is undoubtedly a leading figure in China’s chip design sector.Leading Figures‌.

Among the company’s major shareholders, Wei Shaojun himself is prominently listed, along with the Shanghai Artificial Intelligence Industry Equity Investment Fund, the Shanghai Integrated Circuit Industry Investment Fund (Phase II), and the Beijing Hillhouse Yurun Equity Investment Fund Partnership, among others.

In terms of team size, as of July 2026, Dongfang Suanxin had‌More than 500 people‌. In 2025, the number of online job postings at the company surged compared to 2024‌1167%‌, with computer/network/technology positions accounting for approximately 61.9%, and electronics/electrical/communications technology positions accounting for approximately 23.8%. Monthly salaries for these positions range from approximately 78.5% to 81.7%, with the majority concentrated in‌30k–50k‌The average monthly salary for master’s degree holders ranges from approximately 43.2k to 45k, and for high-level technical positions (such as AI system architects), the monthly salary can reach‌90k–150k‌, and our salaries are among the most competitive in the industry.

Software-Defined + 3D-Stacked Near-Memory Computing Aims to Break Through the ”Memory Wall”

Orient Chip’s technology roadmap can be summarized in eight characters:‌“Software-Defined Chips, Near-Memory Computing”‌.

The company relies on two proprietary core technologies, based on‌Nationally-Produced Supply Chain System‌, to develop high-performance, energy-efficient, and highly flexible high-computing-power chip products. Its original‌“Software-Defined + 3D-Stacked Near-Memory Computing”‌This technical approach offers the core advantages of high computing power and high bandwidth,‌Not reliant on overseas manufacturing processes‌, leveraging a domestically produced supply chain to ensure the security and controllability of high-end domestic computing chips.

The strategic significance of this technological approach is self-evident. AsAI macromodelAs the industry’s focus shifts from training to inference, traditional hardware architectures face severe‌“Memory Wall,” ”Computing Power Wall,” and ”Communication Wall”‌Three Major Challenges. In traditional architectures, data is frequently transferred between storage and computing units, resulting in energy waste of up to 80% and cost increases of 70%. In contrast, Dongfang Suanxin’s 3D-stacked near-memory computing technology, through the vertical integration of storage and computing, significantly reduces interconnect latency and transmission energy consumption, resulting in a marked increase in token output per unit of power consumption.

In terms of patent portfolio, as of 2026, the company has‌35 patent entries, 104 trademark entries‌. Recent patents include:

• ‌“Power-Saving Method Based on Multi-Channel Aggregation Technology for Optical Modules”‌
• ‌“Computational Methods for Attention Mechanisms in Chips”‌
• ‌“FPGA-Based IPU Acceleration Methods for Serialization and Deserialization in Service Meshes”‌
• ‌“Optimization Method and Apparatus for Dynamically Adjusting Chip Power Consumption and Performance”‌(As of May 2026, power utilization at medium-to-low loads can be increased to 70%–100%)
• ‌“Methods, Apparatus, Devices, Storage Media, and Computer Program Products for Model Processing”‌(Filed in April 2026, Publication No. CN121998032A)

In terms of trademarks, the company has registered ”Dongfang Qingyuan,” ”Qingyuan,” ”Tuoyu,” ”Xinyao Dianfeng,” ”Dongfang Suanxin Qidian,” and its English brand name‌SDais, CAAP‌and others, as the brand portfolio continues to expand.

It is worth noting that the ”Tao (τ) Law,” announced on May 25, 2026, by He Tingbo, President of Huawei’s Semiconductor Business Group, whose core concept—achieving an equivalent increase in transistor density through chip architecture innovation, 3D stacking, and hardware-software co-design—aligns perfectly with Dongfang Suanxin’s technical roadmap, further confirming the forward-looking nature of this field.

With Series B Funding on the Horizon, the STAR Market Looks Promising

Looking ahead, Dongfang Suanxin has a clear and steady plan:

‌Short-term (Q4 2026)‌: The company has launched its Series B funding round. Based on its current valuation of 12.275 billion yuan, the scale of this Series B funding round is highly anticipated by the market.

‌Mid-term (2027)‌: Following the completion of the Series B funding round, the company will proceed with its transition to a joint-stock company and begin preparations for an IPO. Based on the listing process for “hard tech” companies on the STAR Market, the preparation period typically lasts 6–12 months, and the company is expected to meet the filing requirements by the end of 2027.

‌Long-term (2028 and beyond)‌: The company plans to submit its prospectus to the STAR Market as early as the first half of 2028. However, it should be noted that the company’s 3D-stacked AI chips are currently still in the laboratory prototype stage and have not yet achieved mass shipments or sustained revenue; therefore, they do not yet meet the STAR Market’s revenue threshold in the short term.

From an industry benchmarking perspective, AI computing power unicorns in the same sector—such as Biren Technology, Muxi, and Suiyuan Technology—generally do not launch their IPOs until they reach Series C or D. Dongfang Suanxin is currently still in the Series A+ stage and will need to undergo several rounds of large-scale financing, including Series B and Series C, before proceeding. However, with a valuation of 12.2 billion yuan, the backing of the National Artificial Intelligence Industry Fund, Wei Shaojun at the helm, and support from industry investors such as Meituan, Xiaomi, JD.com, and Didi, the company’s future holds immense potential.

concluding remarks

Two years ago, it was merely a technological development in a Tsinghua University laboratory; two years later, it has become a rising star in China’s 3D AI chip industry, with a valuation exceeding 10 billion, a team of over 500 people, and 35 patents to its name. The emergence of Dongfang Suanxin not only represents a powerful push forward for China’s semiconductor industry in the post-Moore’s Law era but also serves as a vivid illustration of how the ”software-defined chip” concept has moved from academia to industry.

When Huawei’s ”Tao’s Law” resonates with Dongfang Suanxin’s technological roadmap, and when the domestic supply chain is no longer a weak link but a source of confidence, we have every reason to believe that this new force in the chip industry—rooted in Zhangjiang, backed by Tsinghua University, and serving the entire nation—is writing its own chapter in the pursuit of self-reliance and control over China’s AI computing power.